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AP4511M Advanced Power Electronics Corp. Simple Drive Requirement Low On-resistance Fast Switching Performance D2 D1 D2 D1 D1 D1 D2 D2 N AND P-CHANNEL ENHANCEMENT MODE POWER MOSFET N-CH BVDSS RDS(ON) S2 G1 S2 S1 G1 S1 G2 G2 35V 25m 7A -35V 40m -6.1A SO-8 SO-8 Description The Advanced Power MOSFETs from APEC provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and costeffectiveness. The SO-8 package is universally preferred for all commercialindustrial surface mount applications and suited for low voltage applications such as DC/DC converters. ID P-CH BVDSS RDS(ON) ID D1 D2 G1 S1 G2 S2 Absolute Maximum Ratings Symbol VDS VGS ID@TA=25 ID@TA=70 IDM PD@TA=25 TSTG TJ Parameter Drain-Source Voltage Gate-Source Voltage Continuous Drain Current Continuous Drain Current Pulsed Drain Current 1 3 3 Rating N-channel 35 20 7 5.7 30 2.0 0.016 -55 to 150 -55 to 150 P-channel -35 20 -6.1 -5 -30 Units V V A A A W W/ Total Power Dissipation Linear Derating Factor Storage Temperature Range Operating Junction Temperature Range Thermal Data Symbol Rthj-a Parameter Thermal Resistance Junction-ambient 3 Value Max. 62.5 Unit /W Data and specifications subject to change without notice 201122041 AP4511M N-CH Electrical Characteristics@Tj=25oC(unless otherwise specified) Symbol BVDSS BVDSS/Tj Parameter Drain-Source Breakdown Voltage Test Conditions VGS=0V, ID=250uA Min. 35 1 - Typ. 0.02 18 29 9 11 3 6 12 7 22 6 830 150 110 1.2 Max. Units 25 37 3 1 25 100 18 1330 1.8 V V/ m m V S uA uA nA nC nC nC ns ns ns ns pF pF pF Breakdown Voltage Temperature Coefficient Reference to 25, ID=1mA RDS(ON) Static Drain-Source On-Resistance 2 VGS=10V, ID=7A VGS=4.5V, ID=5A VGS(th) gfs IDSS IGSS Qg Qgs Qgd td(on) tr td(off) tf Ciss Coss Crss Rg Gate Threshold Voltage Forward Transconductance Drain-Source Leakage Current (Tj=25 C) Drain-Source Leakage Current (Tj=70 C) o o VDS=VGS, ID=250uA VDS=10V, ID=7A VDS=35V, VGS=0V VDS=28V, VGS=0V VGS=20V ID=7A VDS=28V VGS=4.5V VDS=18V ID=1A RG=3.3,VGS=10V RD=18 VGS=0V VDS=25V f=1.0MHz f=1.0MHz Gate-Source Leakage Total Gate Charge 2 Gate-Source Charge Gate-Drain ("Miller") Charge Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Input Capacitance Output Capacitance Reverse Transfer Capacitance Gate Resistance 2 Source-Drain Diode Symbol VSD trr Qrr Parameter Forward On Voltage 2 2 Test Conditions IS=1.7A, VGS=0V IS=7A, VGS=0V dI/dt=100A/s Min. - Typ. 18 12 Max. Units 1.2 V ns nC Reverse Recovery Time Reverse Recovery Charge AP4511M P-CH Electrical Characteristics@Tj=25 C(unless otherwise specified) Symbol BVDSS BVDSS/Tj o Parameter Drain-Source Breakdown Voltage Static Drain-Source On-Resistance Gate Threshold Voltage Forward Transconductance Drain-Source Leakage Current (T oC) j=25 Drain-Source Leakage Current (T oC) j=70 2 Test Conditions VGS=0V, ID=-250uA VGS=-10V, ID=-6A VGS=-4.5V, ID=-4A VDS=VGS, ID=-250uA VDS=-10V, ID=-6A VDS=-35V, VGS=0V VDS=-28V, VGS=0V VGS=20V ID=-6A VDS=-28V VGS=-4.5V VDS=-18V ID=-1A RG=3.3,VGS=-10V RD=18 VGS=0V VDS=-25V f=1.0MHz f=1.0MHz Min. -35 -1 - Typ. -0.02 32 50 9 10 2 6 10 6 26 7 690 165 130 5.2 Max. Units 40 60 -3 -1 -25 100 16 1100 7.8 V V/ m m V S uA uA nA nC nC nC ns ns ns ns pF pF pF Breakdown Voltage Temperature Coefficient Reference to 25,ID=-1mA RDS(ON) VGS(th) gfs IDSS IGSS Qg Qgs Qgd td(on) tr td(off) tf Ciss Coss Crss Rg Gate-Source Leakage Total Gate Charge 2 Gate-Source Charge Gate-Drain ("Miller") Charge Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Input Capacitance Output Capacitance Reverse Transfer Capacitance Gate Resistance 2 Source-Drain Diode Symbol VSD trr Qrr Parameter Forward On Voltage 2 2 Test Conditions IS=-1.7A, VGS=0V IS=-6A, VGS=0V dI/dt=-100A/s Min. - Typ. 20 12 Max. Units -1.2 V ns nC Reverse Recovery Time Reverse Recovery Charge Notes: 1.Pulse width limited by Max. junction temperature. 2.Pulse width <300us , duty cycle <2%. 3.Surface mounted on 1 in2 copper pad of FR4 board, t <10sec ; 135 /W when mounted on Min. copper pad. AP4511M N-Channel 50 50 T A = 25 o C 40 10V 7.0V 5.0V ID , Drain Current (A) T A = 150 o C 40 10V 7.0V 5.0V ID , Drain Current (A) 30 30 20 20 10 V G =3.0V 10 V G =3.0V 0 0 1 2 3 4 5 0 0 1 2 3 4 5 V DS , Drain-to-Source Voltage (V) V DS , Drain-to-Source Voltage (V) Fig 1. Typical Output Characteristics Fig 2. Typical Output Characteristics 40 1.8 ID=5A 35 1.6 T A =25 o C Normalized RDS(ON) 1.4 ID=7A V G =10V RDS(ON) (m ) 30 1.2 1.0 25 0.8 20 2 4 6 8 10 0.6 -50 0 50 100 150 V GS , Gate-to-Source Voltage (V) T j , Junction Temperature ( o C) Fig 3. On-Resistance v.s. Gate Voltage Fig 4. Normalized On-Resistance v.s. Junction Temperature 1.5 6 5 1.3 4 Normalized VGS(th) (V) IS(A) T j =150 o C 3 T j =25 o C 1.1 0.9 2 0.7 1 0 0 0.2 0.4 0.6 0.8 1 1.2 0.5 -50 0 50 100 150 V SD , Source-to-Drain Voltage (V) T j , Junction Temperature ( o C) Fig 5. Forward Characteristic of Reverse Diode Fig 6. Gate Threshold Voltage v.s. Junction Temperature AP4511M N-Channel f=1.0MHz 14 1000 C iss VGS , Gate to Source Voltage (V) 12 I D =7A V DS =28V 10 C oss 8 C (pF) 100 C rss 6 4 2 0 0 5 10 15 20 25 10 1 5 9 13 17 21 25 29 Q G , Total Gate Charge (nC) V DS , Drain-to-Source Voltage (V) Fig 7. Gate Charge Characteristics Fig 8. Typical Capacitance Characteristics 100 1 Normalized Thermal Response (Rthja) Duty factor=0.5 10us 10 02 1ms 10ms 01 0.1 0 05 ID (A) 1 100ms o 0 02 0 01 PDM 0.01 Si t T 0.1 T A =25 C Single Pulse Duty factor = t/T Peak Tj = PDM x Rthja + Ta Rthja=135o C/W 0.01 0.1 1 10 100 0.001 0.0001 0.001 0.01 0.1 1 10 100 1000 V DS , Drain-to-Source Voltage (V) t , Pulse Width (s) Fig 9. Maximum Safe Operating Area Fig 10. Effective Transient Thermal Impedance 30 V DS =5V ID , Drain Current (A) T j =25 o C 20 VG T j =150 o C QG 4.5V QGS QGD 10 Charge 0 0 2 4 6 8 Q V GS , Gate-to-Source Voltage (V) Fig 11. Transfer Characteristics Fig 12. Gate Charge Waveform AP4511M P-Channel 50 50 T A = 25 C 40 o -10V 7 0V 40 T A = 150 C -ID , Drain Current (A) o -10V -7.0V -ID , Drain Current (A) 30 30 20 20 V 10 3 0V 10 V 3 0V 0 0 1 2 3 4 5 0 0 1 2 3 4 5 -V DS , Drain-to-Source Voltage (V) -V DS , Drain-to-Source Voltage (V) Fig 1. Typical Output Characteristics Fig 2. Typical Output Characteristics 60 1.4 I D = -4 A 55 o T A =25 C 1.2 I D =-6A V G =-10V Normalized R DS(ON) 50 RDS(ON) (m) 45 1.0 40 0.8 35 0.6 30 3 5 7 9 11 -50 0 50 100 150 -V GS ,Gate-to-Source Voltage (V) T j , Junction Temperature ( o C) Fig 3. On-Resistance v.s. Gate Voltage Fig 4. Normalized On-Resistance v.s. Junction Temperature 1.5 6 Normalized -VGS(th) (V) 5 1.3 4 1.1 -IS(A) 3 T j =150 o C T j =25 o C 0.9 2 0.7 1 0 0 0.2 0.4 0.6 0.8 1 1.2 0.5 -50 0 50 100 150 -V SD , Source-to-Drain Voltage (V) T j , Junction Temperature ( o C) Fig 5. Forward Characteristic of Reverse Diode Fig 6. Gate Threshold Voltage v.s. Junction Temperature AP4511M P-Channel f=1.0MHz 14 10000 12 -VGS , Gate to Source Voltage (V) I D = -6 A V DS = - 28V 10 8 C (pF) 1000 C iss 6 4 C oss 2 C rss 0 0 5 10 15 20 25 100 1 5 9 13 17 21 25 29 Q G , Total Gate Charge (nC) -V DS , Drain-to-Source Voltage (V) Fig 7. Gate Charge Characteristics Fig 8. Typical Capacitance Characteristics 100 1 10 100us 1ms Normalized Thermal Response (Rthja) 0.1 -ID (A) 1 10ms 100ms T =25 o C P DM 0.01 t T 0.1 1s DC Duty factor = t/T Peak Tj = P DM x Rthja + Ta Rthja=135oC/W 0.01 0.1 1 10 100 0.001 0.0001 0.001 0.01 0.1 1 10 100 1000 -V DS , Drain-to-Source Voltage (V) t , Pulse Width (s) Fig 9. Maximum Safe Operating Area Fig 10. Effective Transient Thermal Impedance 30 V DS =-5V -ID , Drain Current (A) T j =25 o C 20 VG T j =150 o C QG -4.5V QGS QGD 10 Charge 0 0 2 4 6 8 Q -V GS , Gate-to-Source Voltage (V) Fig 11. Transfer Characteristics Fig 12. Gate Charge Waveform |
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